Full Product Description
- Dual‑sided telecentric design with both image‑side distortion and object‑side telecentricity below 0.1°, minimizing measurement errors caused by object height variation.
- High MTF performance over 130 lp/mm, ensuring sharp, high‑contrast imaging across the whole field of view.
- Generous depth of field of ±7.3 mm at F16, maintaining clear imaging for samples with height differences.
- Matched with dedicated DTCL‑56‑xW‑y telecentric parallel light source to achieve superior inspection results.
- Robust mechanical construction; total length 178.0 mm, net weight 0.8 kg, stable for long‑term industrial operation.
Core Function
Its core function is to eliminate perspective‑induced measurement deviation. It captures uniform, distortion‑free images to perform precise dimensional measurement, geometric verification and surface defect detection for workpieces.
Typical Applications
Widely used for precision metrology, AOI detection, semiconductor component inspection, electronic parts measurement and other high‑accuracy machine‑vision scenarios.



